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Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras. ==Typical configurations== Two widely used configurations exist for PoP: * Pure memory stacking: two or more memory only packages are stacked on each other * Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard. During PCB Assembly, the bottom package of a PoP stack is placed directly on the PCB, and the other package(s) of the stack are stacked on top. The packages of a PoP stack become attached to each other (and to the PCB) during reflow soldering. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「package on package」の詳細全文を読む スポンサード リンク
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